78 citations · 378 across the 35 of their papers we have counts for
8 papers · 1 filter
A 334W 0.158mm ASIC for Post-Quantum Key-Encapsulation Mechanism Saber with Low-latency Striding Toom-Cook Multiplication Authors Version
Archisman Ghosh, Jose Maria Bermudo Mera, Angshuman Karmakar +4
The hard mathematical problems that assure the security of our current public-key cryptography (RSA, ECC) are broken if and when a quantum computer appears rendering them ineffecti…
EM-X-DL: Efficient Cross-Device Deep Learning Side-Channel Attack with Noisy EM Signatures
Josef Danial, Debayan Das, Anupam Golder +3
This work presents a Cross-device Deep-Learning based Electromagnetic (EM-X-DL) side-channel analysis (SCA), achieving >90% single-trace attack accuracy on AES-128, even in the pre…
Physical Time-Varying Transfer Functions as Generic Low-Overhead Power-SCA Countermeasure
Archisman Ghosh, Debayan Das, Shreyas Sen
Mathematically-secure cryptographic algorithms leak significant side channel information through their power supplies when implemented on a physical platform. These side channel le…
SCNIFFER: Low-Cost, Automated, Efficient Electromagnetic Side-Channel Sniffing
Josef Danial, Debayan Das, Santosh Ghosh +2
Electromagnetic (EM) side-channel analysis (SCA) is a prominent tool to break mathematically-secure cryptographic engines, especially on resource-constrained IoT devices. Presently…
RF-PUF: Enhancing IoT Security through Authentication of Wireless Nodes using In-situ Machine Learning
Baibhab Chatterjee, Debayan Das, Shovan Maity +1
Traditional authentication in radio-frequency (RF) systems enable secure data communication within a network through techniques such as digital signatures and hash-based message au…
RF-PUF: IoT Security Enhancement through Authentication of Wireless Nodes using In-situ Machine Learning
Baibhab Chatterjee, Debayan Das, Shreyas Sen
Physical unclonable functions (PUF) in silicon exploit die-to-die manufacturing variations during fabrication for uniquely identifying each die. Since it is practically a hard prob…
TRIFECTA: Security, Energy-Efficiency, and Communication Capacity Comparison for Wireless IoT Devices
Shreyas Sen, Jinkyu Koo, Saurabh Bagchi
The widespread proliferation of sensor nodes in the era of Internet of Things (IoT) coupled with increasing sensor fidelity and data acquisition modality is expected to generate 3+…
High Efficiency Power Side-Channel Attack Immunity using Noise Injection in Attenuated Signature Domain
Debayan Das, Shovan Maity, Saad Bin Nasir +3
With the advancement of technology in the last few decades, leading to the widespread availability of miniaturized sensors and internet-connected things (IoT), security of electron…