67 citations · 133 across the 8 of their papers we have counts for
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cond-mat.mtrl-sci2018★ 5 cited
High thermal conductivity of bulk epoxy resin by bottom-up parallel-linking and strain: a molecular dynamics study
Shouhang Li, Xiaoxiang Yu, Hua Bao +1
The ultra-low thermal conductivity (~0.3 Wm-1K-1) of amorphous epoxy resins significantly limits their applications in electronics. Conventional top-down methods e.g. electrospinni…
cond-mat.mtrl-sci2015★ 67 cited
Enhancing thermoelectric figure-of-merit by low-dimensional electrical transport in phonon-glass crystals
Xue-Ya Mi, Xiaoxiang Yu, Kai-Lun Yao +3
Low-dimensional electronic and glassy phononic transport are two important ingredients of highly-efficient thermoelectric material, from which two branches of the thermoelectric re…