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Wei-Ling Lv

3 papers hereh-index 152.4k citations36 works total

Matching runs newest-first, so older work may not be attached to this profile yet.

author position
  • first author2

Across the 2 of 3 papers where every author was matched, so the position is known.

fields
  • cond-mat.mtrl-sci2
  • cond-mat.soft1

identity via Semantic Scholar / OpenAlex

most citedUnderstanding Divergent Thermal Conductivity in Single Polythiophene Chains using Modal Analysis and Sonification

18 citations · 28 across the 3 of their papers we have counts for

collaborators
Showing cond-mat.mtrl-sciShow all

2 papers · 1 filter

cond-mat.mtrl-sci2015★ 2 cited

Non-negligible Contributions to Thermal Conductivity From Localized Modes in Amorphous Silicon Dioxide

Wei Lv, Asegun Henry

Thermal conductivity is an important property for almost all applications involving heat transfer, ranging from energy and microelectronics to food processing and textiles. The the…

cond-mat.mtrl-sci2015★ 8 cited

Direct Calculation of Modal Contributions to Thermal Conductivity via Green-Kubo Modal Analysis: Crystalline and Amorphous Silicon

Wei Lv, Asegun Henry

In this letter we derive a new method for direct calculation of the modal contributions to thermal conductivity, which is termed Green-Kubo modal analysis (GKMA). The GKMA method c…

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