2 papers
quant-ph2025
Quantum Diamond Microscopy for Non-Destructive Failure Analysis of an Integrated Fan-Out Package-on-Package iPhone Chip
Bartu Bisgin, Marwa Garsi, Andreas Welscher +2
The increasing complexity of advanced semiconductor packages, driven by chiplet architectures and 2.5D/3D integration, challenges conventional failure localization methods such as…
physics.app-ph2024
Extending Radiowave Frequency Detection Range with Dressed States of Solid-State Spin Ensembles
Jens C. Hermann, Roberto Rizzato, Fleming Bruckmaier +3
Quantum sensors using solid-state spin defects excel in the detection of radiofrequency (RF) fields, serving various purposes in communication, ranging, and sensing. For this purpo…