3 papers
cs.AR2025
TEMP: A Memory Efficient Physical-aware Tensor Partition-Mapping Framework on Wafer-scale Chips
Huizheng Wang, Taiquan Wei, Zichuan Wang +8
Large language models (LLMs) demand significant memory and computation resources. Wafer-scale chips (WSCs) provide high computation power and die-to-die (D2D) bandwidth but face a…
eess.SP2025
WATOS: Efficient LLM Training Strategies and Architecture Co-exploration for Wafer-scale Chip
Huizheng Wang, Zichuan Wang, Hongbin Wang +5
Training large language models (LLMs) imposes extreme demands on computation, memory capacity, and interconnect bandwidth, driven by their ever-increasing parameter scales and inte…
cs.DC2025
MoEntwine: Unleashing the Potential of Wafer-scale Chips for Large-scale Expert Parallel Inference
Xinru Tang, Jingxiang Hou, Dingcheng Jiang +9
As large language models (LLMs) continue to scale up, mixture-of-experts (MoE) has become a common technology in SOTA models. MoE models rely on expert parallelism (EP) to alleviat…