2 papers
math.NA2025
A coupled finite element-virtual element method for thermomechanical analysis of electronic packaging structures
Yanpeng Gong, Sishuai Li, Yue Mei +4
This study presents a finite element and virtual element (FE-VE) coupled method for thermomechanical analysis in electronic packaging structures. The approach partitions computatio…
math.NA2025
Virtual element method for thermomechanical analysis of electronic packaging structures with multi-scale features
Yanpeng Gong, Sishuai Li, Fei Qin +1
This paper presents two approaches: the virtual element method (VEM) and the stabilization-free virtual element method (SFVEM) for analyzing thermomechanical behavior in electronic…