2 papers
physics.app-ph2026
ATSim3.5D: A Multiscale Thermal Simulator for 3.5D-IC Systems based on Nonlinear Multigrid Method
Qipan Wang, Tianxiang Zhu, Yibo Lin +2
To resolve the rising temperatures in 3.5D-ICs, a thermal-aware design flow becomes increasingly crucial, necessitating an accurate and efficient thermal simulation tool. However,…
physics.app-ph2026
ATSim3D: Towards Accurate Thermal Simulator for Heterogeneous 3D-IC Systems Considering Nonlinear Leakage and Conductivity
Qipan Wang, Tianxiang Zhu, Yibo Lin +2
Thermal simulation plays a fundamental role in the thermal design of integrated circuits, especially 3D ICs. Current simulators require significant runtime for high-resolution simu…