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20242026
most citedATSim3D: Towards Accurate Thermal Simulator for Heterogeneous 3D-IC Systems Considering Nonlinear Leakage and Conductivity

6 citations · 9 across the 3 of their papers we have counts for

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math.NA2025

ATMPlace: Analytical Thermo-Mechanical-Aware Placement Framework for 2.5D-IC

Qipan Wang, Tianxiang Zhu, Tianyu Jia +3

Rising demand in AI and automotive applications is accelerating 2.5D IC adoption, with multiple chiplets tightly placed to enable high-speed interconnects and heterogeneous integra…