2 papers
cs.OH2026
A Multiscale Workflow for Thermal Analysis of 3DI Chip Stacks
Max Bloomfield, Amogh Wasti, Zongmin Yang +6
Thermally aware design of 2.5D and 3D advanced packaging systems will require fast, accurate, and powerful thermal analysis of chiplets, stacks, and packages. These systems contain…
physics.comp-ph2025
DiffChip: Thermally Aware Chip Placement with Automatic Differentiation
Giuseppe Romano, Aakrati Jain, Nima Dehmamy +2
Chiplets are modular integrated circuits that can be combined to form a larger system, offering flexibility and performance enhancements. However, their dense packing often leads t…