5 papers
Ion Implantation Enhanced Nucleation Facilitates Heat Transport across Atomically-Sharp Semiconductor Interfaces
Jinwen Liu, Zifeng Huang, Lina Yang +10
Overheating is a critical bottleneck limiting the performance and reliability of next-generation high-power and high-frequency electronics. Interfacial thermal resistance constitut…
Thermal conductance across bonded SiOx-SiOx interfaces in hybrid bonding process
Xingqiang Zhang, Liu Chang, Liyi Li +1
Hybrid bonding is a pivotal technology for enabling three dimensional integrated circuits. Among the foremost challenges facing 3D IC implementation is thermal management, where a…
Experimental Observation of Extremely Strong Defect-Phonon Scatterings in Semiconductor Single Crystals
Zifeng Huang, Jianbo Liang, Yuxiang Wang +5
The role of doping in tailoring thermal transport in semiconductors is critical for efficient thermal management in electronic devices. While the effects of doping have been extens…
Thermal Conductivity of Cubic Silicon Carbide Single Crystals Heavily Doped by Nitrogen
Zifeng Huang, Yunfan Yang, Da Sheng +7
High-purity cubic silicon carbide possesses the second-highest thermal conductivity among large-scale crystals, surpassed only by diamond, making it crucial for practical applicati…
Interfacial reaction boosts thermal conductance of room-temperature integrated semiconductor interfaces stable up to 1100 C
Zhe Cheng, Xiaoyang Ji, Zifeng Huang +7
Overheating has emerged as a primary challenge constraining the reliability and performance of next-generation high-performance electronics, such as chiplets and (ultra)wide bandga…