3 papers
cond-mat.mes-hall2026
Ion Implantation Enhanced Nucleation Facilitates Heat Transport across Atomically-Sharp Semiconductor Interfaces
Jinwen Liu, Zifeng Huang, Lina Yang +10
Overheating is a critical bottleneck limiting the performance and reliability of next-generation high-power and high-frequency electronics. Interfacial thermal resistance constitut…
cond-mat.mes-hall2026
Thermal conductance across bonded SiOx-SiOx interfaces in hybrid bonding process
Xingqiang Zhang, Liu Chang, Liyi Li +1
Hybrid bonding is a pivotal technology for enabling three dimensional integrated circuits. Among the foremost challenges facing 3D IC implementation is thermal management, where a…
cond-mat.mtrl-sci2025
Experimental Observation of Extremely Strong Defect-Phonon Scatterings in Semiconductor Single Crystals
Zifeng Huang, Jianbo Liang, Yuxiang Wang +5
The role of doping in tailoring thermal transport in semiconductors is critical for efficient thermal management in electronic devices. While the effects of doping have been extens…