3 papers
cond-mat.mes-hall2026
Ion Implantation Enhanced Nucleation Facilitates Heat Transport across Atomically-Sharp Semiconductor Interfaces
Jinwen Liu, Zifeng Huang, Lina Yang +10
Overheating is a critical bottleneck limiting the performance and reliability of next-generation high-power and high-frequency electronics. Interfacial thermal resistance constitut…
cond-mat.mes-hall2025
Non-uniform Thermal Conductivity in Nanoscale Multiple Hotspot Systems
Yu He, Zhihao Zhou, Lina Yang +1
Understanding nanoscale hotspot thermal transport is crucial in electronic devices. Contrary to common perception, recent experiments show that closely spaced nanoscale multiple ho…
physics.app-ph2025
Effect of non-Fourier heat transport on temperature distribution in High Bandwidth Memory
Zhihao Zhou, Yu He, Shixian Liu +2
High Bandwidth Memory (HBM), as a key development trend in future memory chip technology, significantly enhances computer performance. At the same time, the thermal challenges aris…