200 citations · 268 across the 5 of their papers we have counts for
Showing cs.ARShow all
2 papers · 1 filter
cs.AR2026
Design-Oriented Modeling of TSV Substrate Noise Coupling to Ring VCOs
Ilias Exouzidis, Alberto Garcia-Ortiz, George Floros +1
Through-silicon vias (TSVs) enable dense vertical interconnects in 3D-IC and chiplet systems, but their metal-oxide-silicon structure introduces significant parasitic coupling path…
cs.AR2025
Design and Optimization of Mixed-Kernel Mixed-Signal SVMs for Flexible Electronics
Florentia Afentaki, Maha Shatta, Konstantinos Balaskas +3
Flexible Electronics (FE) have emerged as a promising alternative to silicon-based technologies, offering on-demand low-cost fabrication, conformality, and sustainability. However,…