45 citations · 159 across the 6 of their papers we have counts for
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Thermal Stability of Thermoelectric Materials via In Situ Resistivity Measurements
K. C. Lukas, W. S. Liu, Q. Jie +2
An experimental setup for determining the electrical resistivity of several types of thermoelectric materials over the temperature range 20 < T < 550 C is described in detail. One…
Transport Properties of Ni, Co, Fe, Mn Doped Cu0.01Bi2Te2.7Se0.3 for Thermoelectric Device Applications
Kevin C. Lukas, Weishu Liu, Zhifeng Ren +1
Bi2Te3 based thermoelectric devices typically use a nickel layer as a diffusion barrier to block the diffusion of solder or copper atoms from the electrode into the thermoelectric…
Thermoelectric Properties of Ho-doped Bi1-xSbx
K. C. Lukas, G. Joshi, K. Modic +2
The Seebeck coefficients, electrical resistivities, total thermal conductivities, and magnetization are reported for temperatures between 5 and 350 K for n-type Bi0.88Sb0.12 nano-c…
Experimental Determination of the Lorenz Number in Cu0.01Bi2Te2.7Se0.3 and Bi0.88Sb0.12
K. C. Lukas, W. S. Liu, G. Joshi +5
Nanostructuring has been shown to be an effective approach to reduce the lattice thermal conductivity and improve the thermoelectric figure of merit. Because the experimentally mea…