most citedMode space approach for tight-binding transport simulations in graphene nanoribbon field-effect transistors including phonon scattering

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physics.app-ph2019

Effects of Filler Configuration and Moisture on Dissipation Factor and Critical Electric Field of Epoxy Composites for HV-ICs Encapsulation

Woojin Ahn, Davide Cornigli, Dhanoop Varghese +4

Molding compounds (MCs) have been used extensively as an encapsulation material for integrated circuits, however, MCs are susceptible to moisture and charge spreading over time. Th…