collaborators

1 paper

cond-mat.mes-hall2013

Characterization of intra device mutual thermal coupling in multi finger SiGe:C HBTs

Mario Weiß, Amit Kumar Sahoo, Cristian Raya +4

This paper studies the mutual coupling in trench isolated multi emitter bipolar transistors fabricated in a Si/SiGe:C HBT technology STMicroelectronics featuring fT and fmax of ~30…