1 citations · 1 across the 2 of their papers we have counts for
3 papers
cs.ET2012★ 1 cited
Thermal analysis & optimization of a 3 dimensional heterogeneous structure
Ramya Menon C., Vinod Pangracious
Besides the lot of advantages offered by the 3D stacking of devices in an integrated circuit there is a chance of device damage due to rise in peak temperature value. Hence, in ord…
cs.ET2012
A Novel Methodology for Thermal Aware Silicon Area Estimation for 2D & 3D MPSoCs
Ramya Menon C., Vinod Pangracious
In a multiprocessor system on chip (MPSoC) IC the processor is one of the highest heat dissipating devices. The temperature generated in an IC may vary with floor plan of the chip.…
cs.AR2011
A Novel Methodology for Thermal Analysis & 3-Dimensional Memory Integration
Annmol Cherian, Ajay Augustine, Jemy Jose +1
The semiconductor industry is reaching a fascinating confluence in several evolutionary trends that will likely lead to a number of revolutionary changes in the design, implementat…