1 citations · 1 across the 2 of their papers we have counts for
2 papers
cs.ET2012★ 1 cited
Thermal analysis & optimization of a 3 dimensional heterogeneous structure
Ramya Menon C., Vinod Pangracious
Besides the lot of advantages offered by the 3D stacking of devices in an integrated circuit there is a chance of device damage due to rise in peak temperature value. Hence, in ord…
cs.ET2012
A Novel Methodology for Thermal Aware Silicon Area Estimation for 2D & 3D MPSoCs
Ramya Menon C., Vinod Pangracious
In a multiprocessor system on chip (MPSoC) IC the processor is one of the highest heat dissipating devices. The temperature generated in an IC may vary with floor plan of the chip.…