51 citations · 96 across the 2 of their papers we have counts for
8 papers
The PHENIX Forward Silicon Vertex Detector
C. Aidala, L. Anaya, E. Anderssen +82
A new silicon detector has been developed to provide the PHENIX experiment with precise charged particle tracking at forward and backward rapidity. The Forward Silicon Vertex Track…
The D0 Silicon Microstrip Tracker
S. N. Ahmed, R. Angstadt, M. Aoki +131
This paper describes the mechanical design, the readout chain, the production, testing and the installation of the Silicon Microstrip Tracker of the D0 experiment at the Fermilab T…
Demonstration of fine pitch FCOB (Flip Chip on Board) assembly based on solder bumps at Fermilab
M. Trimpl, E. Skup, R. Yarema +1
Bump bonding is a superior assembly alternative compared to conventional wire bond techniques. It offers a highly reliable connection with greatly reduced parasitic properties. The…
D0 Silicon Microstrip Tracker
Sergey Burdin
The D0 Run II silicon microstrip tracker (SMT) has 3 square meters of Si area. There are 792,576 channels read out by 6192 SVXIIe chips on 912 read out modules. The SMT provides tr…
Single Event Effects in the Pixel readout chip for BTeV
G. Chiodini, J. A. Appel, G. Cardoso +7
In future experiments the readout electronics for pixel detectors is required to be resistant to a very high radiation level. In this paper we report on irradiation tests performed…
Performance of prototype BTeV silicon pixel detectors in a high energy pion beam
J. A. Appel, M. Artuso, J. N. Butler +21
The silicon pixel vertex detector is a key element of the BTeV spectrometer. Sensors bump-bonded to prototype front-end devices were tested in a high energy pion beam at Fermilab.…