6 papers
Active Passivation Tunes Hotspot Locations in GaN Transistors with In Situ Thermal Mechanical Visualization
Yicheng Wei, Sihang Liu, Zimu Jiang +6
Efficient thermal dissipation has become critical in emerging electronic devices. However, most existing studies have primarily focused on engineering heat dissipation pathways, la…
High Thermal Conductivity in Back-End-of-Line Compatible AlN Thin Films
Xufei Guo, Zirou Chen, Zifeng Huang +3
With thermal issues becoming a major challenge to the development of integrated circuits (ICs), high-thermal-conductivity (high-TC) materials are gaining interest from both the ind…
Ion Implantation Enhanced Nucleation Facilitates Heat Transport across Atomically-Sharp Semiconductor Interfaces
Jinwen Liu, Zifeng Huang, Lina Yang +10
Overheating is a critical bottleneck limiting the performance and reliability of next-generation high-power and high-frequency electronics. Interfacial thermal resistance constitut…
Experimental Observation of Extremely Strong Defect-Phonon Scatterings in Semiconductor Single Crystals
Zifeng Huang, Jianbo Liang, Yuxiang Wang +5
The role of doping in tailoring thermal transport in semiconductors is critical for efficient thermal management in electronic devices. While the effects of doping have been extens…
Thermal Conductivity of Cubic Silicon Carbide Single Crystals Heavily Doped by Nitrogen
Zifeng Huang, Yunfan Yang, Da Sheng +7
High-purity cubic silicon carbide possesses the second-highest thermal conductivity among large-scale crystals, surpassed only by diamond, making it crucial for practical applicati…
Interfacial reaction boosts thermal conductance of room-temperature integrated semiconductor interfaces stable up to 1100 C
Zhe Cheng, Xiaoyang Ji, Zifeng Huang +7
Overheating has emerged as a primary challenge constraining the reliability and performance of next-generation high-performance electronics, such as chiplets and (ultra)wide bandga…