3 papers
cond-mat.mtrl-sci2026
Role of surface states and band modulations in ultrathin ruthenium interconnects
Gyungho Maeng, Subeen Lim, Mi Gyoung Lee +3
Mitigating the RC delay from transistor miniaturization is essential for next-generation devices, driving a focus on interconnect electrical performance. Current copper-based inter…
cond-mat.mtrl-sci2026
First-principles high-throughput screening of ruthenium compounds for advanced interconnects
Gyungho Maeng, Subeen Lim, Bonggeun Shong +1
As interconnect dimensions continue to shrink, the industry-standard copper faces a critical increase in resistivity, presenting a significant hurdle to overall device performance.…
cond-mat.mtrl-sci2025
Scale-robust Low Resistance Transport in Atomic Layer Deposited Topological Semimetal Wafers on Amorphous Substrate
Dong-Hyun Lim, Young-Min Song, Yeji Kim +8
As data-centric computing advances, energy-efficient interconnects are increasingly critical for AI-driven systems. Traditional metal conductors face severe limitations at nanoscal…