2 papers
physics.app-ph2018
Coefficient of Thermal Expansion Mismatch Induced Stress Calculation for Field Assisted Bonding of Silicon to Glass
Leonid S. Sinev, Vladimir T. Ryabov
The residual stress induced in assembly is a common concern in electronic packaging. The mismatch in coefficient of thermal expansion between borosilicate glass and silicon, upon t…
physics.app-ph2018
Coefficient of Thermal Expansion Balancing for Field Assisted Bonding of Silicon to Glass
Leonid S. Sinev, Vladimir T. Ryabov
Stresses caused by thermal expansion coefficients mismatch of anodically bonded glass and silicon samples are studied. An analytical model to determine graphically the optimum bond…