most citedA Methodology for Thermal Simulation of Interconnects Enabled by Model Reduction with Material Property Variation

11 citations · 11 across the 1 of their papers we have counts for

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cond-mat.mtrl-sci2021★ 11 cited

A Methodology for Thermal Simulation of Interconnects Enabled by Model Reduction with Material Property Variation

Wangkun Jia, Ming-C. Cheng

A thermal simulation methodology is developed for interconnects enabled by a data-driven learning algorithm accounting for variations of material properties, heat sources and bound…