most citedA Survey of Detection Methods for Die Attachment and Wire Bonding Defects in Integrated Circuit Manufacturing

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eess.SP2022★ 1 cited

A Survey of Detection Methods for Die Attachment and Wire Bonding Defects in Integrated Circuit Manufacturing

Lamia Alam, Nasser Kehtarnavaz

Defect detection plays a vital role in the manufacturing process of integrated circuits (ICs). Die attachment and wire bonding are two steps of the manufacturing process that deter…