Predictive Structure to Thermal Conductivity Modeling Framework for BEOL Interconnect Stacks in Advanced Technology Nodes Enabled by Extensive Layer Resolved Thermal Measurements

Zifeng Huang, Yiyang Sun, Tianyu Jia +2

The increasing structural complexity of BEOL interconnect stacks in advanced integrated circuits demands a structure-aware thermal conductivity (\k{appa}) modeling framework. Howev…