3 citations · 7 across the 5 of their papers we have counts for
5 papers
Plated-Through-Hole Via Design Specifications for 112G Serial Links
Michael J. Degerstrom, Chad M. Smutzer, Richard B. Ericson +2
An earlier study of a high layer-count test board using plated-through-hole (PTH) vias and a limited quantity of laser vias was shown to be capable of supporting 112 Gb/s PAM-4 lin…
Inverting the SerDes Link Design Flow Process
Michael J. Degerstrom, Chad M. Smutzer, Patrick J. Zabinski +1
The traditional SerDes link simulation process begins with the extraction of printed circuit board (PCB) physical stripline and via models, followed by channel modeling and link si…
56 Gbps PCB Design Strategies for Clean, Low-Skew Channels
Michael J. Degerstrom, Chad M. Smutzer, Barry K. Gilbert +1
Although next generation (>28 Gbps) SerDes standards have been contemplated for several years, it has not been clear whether PCB structures supporting 56 Gbps NRZ will be feasible…
A Zero Sum Signaling Method for High Speed, Dense Parallel Bus Communications
Chad M. Smutzer, Robert W. Techentin, Michael J. Degerstrom +2
Complex digital systems such as high performance computers (HPCs) make extensive use of high-speed electrical interconnects, in routing signals among processing elements, or betwee…
High Speed Parallel Signal Crosstalk Cancellation Concept
Chad M. Smutzer, Michael J. Degerstrom, Barry K. Gilbert +1
High performance computing (HPC) systems make extensive use of high speed electrical interconnects, in routing signals among processing elements, or between processing elements and…