collaborators

11 papers

physics.app-ph2026

A transfer-learning-enhanced POD-FNN surrogate for rapid signal prediction and inverse fitting in thermoreflectance with patterned transducers

Bingjia Xiao, Tao Chen, Puqing Jiang

Patterned-transducer thermoreflectance enhances sensitivity to low-thermal-conductivity materials by suppressing lateral heat spreading in the metal transducer, but its wider use i…

physics.app-ph2026

A Variable-Spot-Size and Multi-Frequency Square-Pulsed Source (SPS) Approach for Comprehensive Characterization of Anisotropic Thermal Transport Properties in Multilayered Thin Films

Kexin Zhang, Tao Chen, Jinlong Ma +1

Multilayered thin-film structures are frequently encountered in industrial applications, where accurate thermal property characterization is essential for performance optimization.…

physics.app-ph2026

Simultaneous, Non-Contact Measurement of Liquid and Interfacial Thermal Properties via a Differential Square-Pulsed Source Method

Tao Chen, Puqing Jiang

Accurate characterization of heat transport across solid-liquid interfaces is essential for thermal management in micro and nanoscale systems. Yet existing techniques often require…

physics.app-ph2026

Universal thermometry of solid-liquid interfacial thermal conductance

Tao Chen, Puqing Jiang

Solid-liquid interfacial thermal conductance (ITC) critically influences heat transport in microfluidic, electronic, and energy systems, yet most optical thermometry techniques are…

physics.app-ph2026

Anisotropic Thermal Characterization of Suspended and Spin-Coated Polyimide Films Using a Square-Pulsed Source Method

Bingjiang Zhang, Dihui Wang, Tao Chen +2

Polyimide (PI) thin films are widely used in advanced technologies, yet accurate characterization of their thermal properties remains challenging, as evidenced by significant incon…

physics.app-ph2026

Simultaneous measurement of pressure-dependent bulk and interfacial thermal properties in thermal interface materials using square-pulsed source thermoreflectance

Tao Chen, Bingjia Xiao, Xin Qian +1

Thermal interface materials (TIMs) critically regulate heat dissipation from electronic chips to heat spreaders, yet their thermal conductivity (k), volumetric heat capacity (C), a…