2 papers
eess.IV2023
In-Situ Thickness Measurement of Die Silicon Using Voltage Imaging for Hardware Assurance
Olivia P. Dizon-Paradis, Nitin Varshney, M Tanjidur Rahman +3
Hardware assurance of electronics is a challenging task and is of great interest to the government and the electronics industry. Physical inspection-based methods such as reverse e…
cs.CR2022
AFIA: ATPG-Guided Fault Injection Attack on Secure Logic Locking
Yadi Zhong, Ayush Jain, M. Tanjidur Rahman +3
The outsourcing of the design and manufacturing of integrated circuits has raised severe concerns about the piracy of Intellectual Properties and illegal overproduction. Logic lock…