2 papers
cs.CE2026
Transient Multiscale Workflow for Thermal Analysis of 3DHI Chip Stack
Mohammad Elahi, Max O. Bloomfield, Theodorian Borca-Tasciuc +1
Modern package designs make use of technologies such as backside power delivery (BSPD) and 3D stacked chiplets that require accounting for the heterogeneity in back end of the line…
cs.OH2026
A Multiscale Workflow for Thermal Analysis of 3DI Chip Stacks
Max Bloomfield, Amogh Wasti, Zongmin Yang +6
Thermally aware design of 2.5D and 3D advanced packaging systems will require fast, accurate, and powerful thermal analysis of chiplets, stacks, and packages. These systems contain…