97 citations · 171 across the 7 of their papers we have counts for
7 papers
Cross talk of a large-scale depleted monolithic active pixel sensor (DMAPS) in 180 nm CMOS technology
Lars Schall, Christian Bespin, Ivan Caicedo +11
Monolithic pixel detectors combine readout electronics and sensor in a single entity of silicon, which simplifies the production procedure and lowers the material budget compared t…
Charge collection and efficiency measurements of the TJ-Monopix2 DMAPS in 180nm CMOS technology
Christian Bespin, Ivan Caicedo, Jochen Dingfelder +10
Monolithic CMOS pixel detectors have emerged as competitive contenders in the field of high-energy particle physics detectors. By utilizing commercial processes they offer high-vol…
Characterization and Verification Environment for the RD53A Pixel Readout Chip in 65 nm CMOS
Marco Vogt, Hans Krüger, Tomasz Hemperek +3
The RD53 collaboration is currently designing a large scale prototype pixel readout chip in 65 nm CMOS technology for the phase 2 upgrades at the HL-LHC. The RD53A chip will be ava…
Depleted fully monolithic CMOS pixel detectors using a column based readout architecture for the ATLAS Inner Tracker upgrade
T. Wang, M. Barbero, I. Berdalovic +25
Depleted monolithic active pixel sensors (DMAPS), which exploit high voltage and/or high resistivity add-ons of modern CMOS technologies to achieve substantial depletion in the sen…
Characterization of Fully Depleted CMOS Active Pixel Sensors on High Resistivity Substrates for Use in a High Radiation Environment
Toko Hirono, Marlon Barbero, Patrick Breugnon +12
Depleted CMOS active sensors (DMAPS) are being developed for high-energy particle physics experiments in high radiation environments, such as in the ATLAS High Luminosity Large Had…
DMAPS: a fully depleted monolithic active pixel sensor - analog performance characterization
Miroslav Havránek, Tomasz Hemperek, Hans Krüger +5
Monolithic Active Pixel Sensors (MAPS) have been developed since the late 1990s based on silicon substrates with a thin epitaxial layer (thickness of 10-15 m) in which charge is…
Single Photon Counting X-ray Imaging with Si and CdTe Single Chip Pixel Detectors and Multichip Pixel Modules
Peter Fischer, Sven Krimmel, Hans Krueger +5
Multichip modules (MCM) with 4 single photon counting MPEC 2.3 chips bump bonded to 1.3 cm x 1.3 cm large CdTe and Si semiconductor sensors as well as to single chip pixel detector…