Wafer-to-Wafer Bonding: Part: I -- The Coupled Physics Problem and the 2D Finite Element Implementation

Kamalendu Ghosh, Bhavesh Shrimali, Subin Jeong

Wafer-to-wafer (WxW) bonding is a key enabler for three-dimensional integration, including hybrid bonding for fine-pitch Cu--Cu interconnects. During bonding, wafer deformation and…