Testbeam characterization of a 3D silicon sensor read out by Timepix4

E. Chatzianagnostou, M. J. Madurai, K. Akiba +15

Testbeam results from a $300\mu \mathrm{m}$-thick 3D silicon sensor bump-bonded to a Timepix4 ASIC, are presented. The hit detection efficiency, spatial resolution, and timing perfo…