4 papers
Development of Small-pitch, Ultra-thin 3D Silicon Sensors at USTC
Kuo Ma, De Zhang, Shengjia He +13
We report on the development of 3D silicon sensors at the University of Science and Technology of China (USTC). The sensor involves columnar electrodes (5 um in diameter) of both d…
Design and Characterization of Racetrack 3D-Trench Silicon Sensor Based on 8-Inch Process with Excellent Time Resolution
Huimin Ji, Manwen Liu, Kuo Ma +5
In the extreme environments of high-luminosity colliders, traditional planar silicon sensors suffer severe radiation-induced performance degradation and fail to satisfy the stringe…
Development of 3D Pixel Sensors via an 8-inch CMOS-Compatible Process
Huimin Ji, Zhihua Li, Wenzheng Cheng +6
In the construction of High-Luminosity Large Hadron Collider (HL-LHC) and Future Circular Collider (FCC) experiments, 3D pixel sensors have become indispensable components due to t…
Design, fabrication and initial test of a novel 3D-Trench sensor utilizing 8-inch CMOS compatible technology
Manwen Liu, Huimin Ji, Wenzheng Cheng +10
The 3D silicon sensor has demonstrated excellent performances (signal collection, detection efficiency, power consumption, etc.) comparable or even better with respect to the tradi…