3 papers
math.NA2026
WarpagePINN: Thermal Warpage Prediction in Advanced Packaging via a Two-Stage Physics-Informed Neural Networks
Xinyu Li, Min Tang, Zeyu Sun +3
Thermal warpage has become a critical issue in advanced packaging, primarily caused by the mismatch in coefficients of thermal expansion (CTE) among heterogeneously integrated mate…
eess.SP2024
Multiperson Detection and Vital-Sign Sensing Empowered by Space-Time-Coding RISs
Xinyu Li, Jian Wei You, Ze Gu +4
Passive human sensing using wireless signals has attracted increasing attention due to its superiorities of non-contact and robustness in various lighting conditions. However, when…
eess.SP2023
Passive Human Sensing Enhanced by Reconfigurable Intelligent Surface: Opportunities and Challenges
Xinyu Li, Jian Wei You, Ze Gu +5
Reconfigurable intelligent surfaces (RISs) have flexible and exceptional performance in manipulating electromagnetic waves and customizing wireless channels. These capabilities ena…