2 papers
cs.AR2026
CLIP-3D: Closed-Loop Evaluation of Performance and Physical Constraints for 3D ICs
Shuo Ren, Libo Shen, Yaohui Han +6
3D integration packs more power into a smaller footprint, so a candidate design's actual throughput depends on its layout: which macro sits on which tier, where the hot spot lands,…
cs.AR2026
CUTh-Solver: GPU-Accelerated Sparse Matrix Solver for High-Resolution Thermal Simulation of 3D ICs
Chenghan Wang, Zhen Zhuang, Shui Jiang +9
Coarse-grained thermal simulation tends to underestimate localized thermal issues, potentially missing critical hotspots. Accurate analysis, therefore, demands fine-grained informa…