2 papers
cs.ET2026
Beyond HBM-on-GPU: Thermal Design Envelope for 3D Volumetric DRAM-on-GPU Integration
Yukai Chen, Melina Lofrano, Khakim Akhunov +12
The scaling of GPUs for AI and HPC workloads is increasingly constrained by the capacity, bandwidth, and thermal limits of both 2.5D HBM-GPU and direct-stacked 3D HBM-on-GPU integr…
physics.app-ph2026
Are gate-all-around 2D CFETs the optimal architecture for the A2 node and beyond?
Fengben Xi, Gautam Gaddemane, Anshul Gupta +15
As logic scaling enters the angstrom era, vertically stacked complementary field-effect transistors (CFETs) based on atomically thin two-dimensional (2D) semiconductors offer a pot…