2 papers
cs.ET2026
Partitioning-free 3D-IC Floorplanning
Shuo Ren, Rongliang Fu, Libo Shen +5
3D integration with fine-pitch hybrid bonding offers a promising path to alleviate interconnect bottlenecks in conventional two-dimensional (2D) ICs, yet efficient 3D floorplanning…
cs.AR2026
Differentiable Routability-Driven Package Floorplanning with Pin Assignment
Yiqi Huang, Zepeng Li, Zhen Zhuang +3
As advanced packaging technology evolves, increasing interconnect density in redistribution layers (RDLs) makes routability critical to package floorplanning. Meanwhile, power inte…