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physics.ins-det2026
Testbeam characterization of a 3D silicon sensor read out by Timepix4
E. Chatzianagnostou, M. J. Madurai, K. Akiba +15
Testbeam results from a -thick 3D silicon sensor bump-bonded to a Timepix4 ASIC, are presented. The hit detection efficiency, spatial resolution, and timing perfo…
physics.ins-det2026
The RD50-MPW4: A Radiation Hard HV CMOS Sensor for Future Colliders
Jory Sonneveld, Thomas Bergauer, Raimon Casanova +17
The former CERN RD50 collaboration develops monolithic active pixel high voltage (HV) CMOS sensors for future colliders with the aim of high radiation tolerance, good time resoluti…