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cs.AR2026
CLIP-3D: Closed-Loop Evaluation of Performance and Physical Constraints for 3D ICs
Shuo Ren, Libo Shen, Yaohui Han +6
3D integration packs more power into a smaller footprint, so a candidate design's actual throughput depends on its layout: which macro sits on which tier, where the hot spot lands,…
cs.AR2026
Chiplet3D: Pin- and Thermal-Aware 3D Chiplet Floorplanning via Convolution-Embedded MILP
Shuo Ren, Libo Shen, Yaohui Han +4
As traditional Moore's Law scaling slows down, 3D-ICs stack multiple active dies vertically to sustain performance scaling. However, this vertical stacking traps heat inside, makin…