From the 2 of 8 linked papers with an AI index.
8 papers
SynAct: A Reasoning-Acting Large Language Model Agent for Adaptive Synthesis Optimization
Fangzhou Liu, Peiyi Han, Jiawei Liu +5
Logic synthesis transforms RTL designs into gate-level netlists, where PPA results are highly sensitive to the choice of optimization commands, making synthesis tuning both high-di…
AgenticECO: An Agentic Framework for ECO on 3D Integrated Circuits
Shuo Ren, Yaohui Han, Libo Shen +4
As Moore's law slows, the industry is turning to three-dimensional integration; yet in merged 3D-IC flows, routed designs expose bond-level defects with no 2D analogue, and post-ro…
Differentiable Routability-Driven Package Floorplanning with Pin Assignment
Yiqi Huang, Zepeng Li, Zhen Zhuang +3
The paper introduces a differentiable optimization framework for package floorplanning and pin assignment that directly models chip orientations and fan‑out congestion, achieving f…
CLIP-3D: Closed-Loop Evaluation of Performance and Physical Constraints for 3D ICs
Shuo Ren, Libo Shen, Yaohui Han +6
The paper introduces CLIP-3D, a methodology that integrates power, cache, and thermal models with architectural simulation to evaluate the performance and physical constraints of 3…
AgenticPD: A Stage-Aware Agentic Framework for Physical Design QoR Optimization
Shuo Ren, Zijin Cheng, Yaohui Han +7
Physical design quality-of-results~(QoR) optimization is hard and expensive. Choices made at one stage can help or hurt later stages. Each evaluation requires a costly EDA run thro…
Chiplet3D: Pin- and Thermal-Aware 3D Chiplet Floorplanning via Convolution-Embedded MILP
Shuo Ren, Libo Shen, Yaohui Han +4
As traditional Moore's Law scaling slows down, 3D-ICs stack multiple active dies vertically to sustain performance scaling. However, this vertical stacking traps heat inside, makin…