Thermal Tuning Overhead in Wafer-Scale Optical Interconnects for LLM MoE Training: A Cross-Layer Analysis and Ferroelectric-Based Mitigation

Seongwon Yoon, Pin-Jun Chen, Shimeng Yu

The rapid scaling of large language models (LLMs), particularly mixture-of-experts (MoE) architectures, has intensified interconnect demands because expert-parallel execution is co…