activity
20082024
most citedThickness dependence of the resistivity of Platinum group metal thin films

223 citations · 386 across the 10 of their papers we have counts for

collaborators

10 papers

cond-mat.mtrl-sci2024★ 7 cited

Sub-40mV Sigma-VTH IGZO nFETs in 300mm Fab

Jerome Mitard, Luka Kljucar, Nouredine Rassoul +19

Back and double gate IGZO nFETs have been demonstrated down to 120nm and 70nm respectively leveraging 300mm fab processing. While the passivation of oxygen vacancies in IGZO is cha…

cond-mat.mtrl-sci2023★ 2 cited

Dilute Rhenium Doping and its Impact on Intrinsic Defects in MoS2

Riccardo Torsi, Kyle T. Munson, Rahul Pendurthi +11

Substitutionally-doped 2D transition metal dichalcogenides are primed for next-generation device applications such as field effect transistors (FET), sensors, and optoelectronic ci…

cond-mat.mtrl-sci2022★ 12 cited

Modeling X-ray Photoelectron Spectroscopy of Macromolecules Using GW

Laura Galleni, Faegheh S. Sajjadian, Thierry Conard +3

We propose a simple additive approach to simulate X-ray photoelectron spectra (XPS) of macromolecules based on the method. Single-shot () is a promising technique…

cond-mat.mtrl-sci2022★ 49 cited

Hole-doping induced ferromagnetism in 2D materials

R. Meng, L. M. C. Pereira, J. P. Locquet +3

Two-dimensional (2D) ferromagnetic materials are considered as promising candidates for the future generations of spintronic devices. Yet, 2D materials with intrinsic ferromagnetis…

cond-mat.mtrl-sci2021★ 16 cited

First-principles-based screening method for resistivity scaling of anisotropic metals

Kristof Moors, Kiroubanand Sankaran, Geoffrey Pourtois +1

The resistivity scaling of metals is a crucial limiting factor for further downscaling of interconnects in nanoelectronic devices that affects signal delay, heat production, and en…

cond-mat.mtrl-sci2020★ 33 cited

Ab initio screening of metallic MAX ceramics for advanced interconnect applications

Kiroubanand Sankaran, Kristof Moors, Zsolt Tőkei +2

The potential of a wide range of layered ternary carbide and nitride MAX phases as conductors in interconnect metal lines in advanced CMOS technology nodes has been evaluated using…