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cs.OH2008
Through Silicon Vias as Enablers for 3D Systems
E. Jung, Andreas Ostmann, Peter Ramm +3
This special session on 3D TSV's will highlight some of the fabrication processes and used technologies to create vias from the frontside of an active circuit to its backside and p…
cs.OH2008★ 1 cited
Technologies for 3D Heterogeneous Integration
Jürgen Wolf, P. Ramm, Armin Klumpp +1
3D-Integration is a promising technology towards higher interconnect densities and shorter wiring lengths between multiple chip stacks, thus achieving a very high performance level…