13 citations · 19 across the 3 of their papers we have counts for
4 papers
Nanoelectromechanical Systems (NEMS) for Hardware Security in Advanced Packaging
Himanandhan Reddy Kottur, Pavanbabu Arjunamahanthi, M. Shafkat M. Khan +3
As hardware security threats escalate across semiconductor manufacturing and advanced packaging, there is a growing need for novel physical mechanisms to counter sophisticated atta…
US Microelectronics Packaging Ecosystem: Challenges and Opportunities
Rouhan Noor, Himanandhan Reddy Kottur, Patrick J Craig +9
The semiconductor industry is experiencing a significant shift from traditional methods of shrinking devices and reducing costs. Chip designers actively seek new technological solu…
From Talent Shortage to Workforce Excellence in the CHIPS Act Era: Harnessing Industry 4.0 Paradigms for a Sustainable Future in Domestic Chip Production
Aida Damanpak Rizi, Antika Roy, Rouhan Noor +8
The CHIPS Act is driving the U.S. towards a self-sustainable future in domestic chip production. Decades of outsourced manufacturing, assembly, testing, and packaging has diminishe…
In-Situ Thickness Measurement of Die Silicon Using Voltage Imaging for Hardware Assurance
Olivia P. Dizon-Paradis, Nitin Varshney, M Tanjidur Rahman +3
Hardware assurance of electronics is a challenging task and is of great interest to the government and the electronics industry. Physical inspection-based methods such as reverse e…