13 citations · 14 across the 4 of their papers we have counts for
4 papers
Enhancing Co-packaging Optics Enabled Silicon Photonics Security Assurance Hardware Fingerprinting
Liton Kumar Biswas, M Shafkat M Khan, Himanandhan Reddy Kottur +3
Silicon photonics enables integration of optical components using standard semiconductor processes, greatly improving data communication bandwidth and energy efficiency. However, p…
AI-Driven Thermal Mapping and Management in 3D Integrated Photonic Circuits
Liton Kumar Biswas, Katayoon Yahyaei, Shajib Ghosh +5
Photonic Integrated Circuits (PICs) are advancing high-performance computing, data centers, and sensing, yet three-dimensional (3D) PICs introduce critical thermal management chall…
Nanoelectromechanical Systems (NEMS) for Hardware Security in Advanced Packaging
Himanandhan Reddy Kottur, Pavanbabu Arjunamahanthi, M. Shafkat M. Khan +3
As hardware security threats escalate across semiconductor manufacturing and advanced packaging, there is a growing need for novel physical mechanisms to counter sophisticated atta…
US Microelectronics Packaging Ecosystem: Challenges and Opportunities
Rouhan Noor, Himanandhan Reddy Kottur, Patrick J Craig +9
The semiconductor industry is experiencing a significant shift from traditional methods of shrinking devices and reducing costs. Chip designers actively seek new technological solu…