4 papers
AI-Driven Thermal Mapping and Management in 3D Integrated Photonic Circuits
Liton Kumar Biswas, Katayoon Yahyaei, Shajib Ghosh +5
Photonic Integrated Circuits (PICs) are advancing high-performance computing, data centers, and sensing, yet three-dimensional (3D) PICs introduce critical thermal management chall…
Design Guidelines for In-line X-ray Inspection in Advanced Packaging Technology: A CoWoS Case Study
Katayoon Yahyaei, M Shafkat M Khan, Guillermo Cadima +2
The shift towards advanced packaging technologies, including 2.5D and 3D integration, addresses the limitations of traditional methods while meeting increasing demands for performa…
Nanoelectromechanical Systems (NEMS) for Hardware Security in Advanced Packaging
Himanandhan Reddy Kottur, Pavanbabu Arjunamahanthi, M. Shafkat M. Khan +3
As hardware security threats escalate across semiconductor manufacturing and advanced packaging, there is a growing need for novel physical mechanisms to counter sophisticated atta…
Failure Analysis in Transition: An Industry Survey of Challenges, Priorities, and Standardization Needs in Advanced Packaging and Heterogeneous Integration
Himanandhan Reddy Kottur, Nusra Akter Takia, Mahamudul Hassan Fuad +3
Failure analysis is being reshaped by heterogeneous integration, chiplet-based architectures, hybrid bonding, backside technologies, & increasingly buried package structures. To ex…