3 papers
cs.CE2026
Therm-FM: Foundation Model is ALL YOU NEED for 3D-ICs Thermal Simulation
Zhen Huang, Haiyang Xin, Wenkai Yang +6
Data-driven thermal predictors for 3D-ICs are often trained from scratch for each chip design using many high-fidelity finite-element simulations, leading to high data-generation c…
cs.AR2025
SetupKit: Efficient Multi-Corner Setup/Hold Time Characterization Using Bias-Enhanced Interpolation and Active Learning
Junzhuo Zhou, Ziwen Wang, Haoxuan Xia +5
Accurate setup/hold time characterization is crucial for modern chip timing closure, but its reliance on potentially millions of SPICE simulations across diverse process-voltagetem…
cs.LG2025
Self-Attention to Operator Learning-based 3D-IC Thermal Simulation
Zhen Huang, Hong Wang, Wenkai Yang +6
Thermal management in 3D ICs is increasingly challenging due to higher power densities. Traditional PDE-solving-based methods, while accurate, are too slow for iterative design. Ma…