3 papers
cond-mat.mtrl-sci2025
Atomistic Simulations of H-Cu Vacancy Cosegregation and H Diffusion in Cu Grain Boundary
Vasileios Fotopoulos, Alexander L. Shluger
Hydrogen embrittlement remains a critical challenge in structural and electronic applications of copper (Cu) but its mechanism is still not fully understood. In this study, we comb…
cond-mat.mtrl-sci2023
First principles study on the segregation of metallic solutes and non-metallic impurities in Cu grain boundary
Vasileios Fotopoulos, Jack Strand, Manuel Petersmann +1
Metallic dopants have the potential to increase the mechanical strength of polycrystalline metals. These elements are expected to aggregate in regions of lower coordination, such a…
cond-mat.mtrl-sci2023
Modeling the effects of varying Ti concentration on the mechanical properties of Cu-Ti alloys
Vasileios Fotopoulos, Corey S. O'Hern, Mark D. Shattuck +1
The mechanical properties of Cu-Ti alloys have been characterized extensively through experimental studies. However, a detailed understanding of why the strength of Cu increases af…