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Jianfeng Gao

4 papers hereh-index 171.3k citations117 works total

Matching runs newest-first, so older work may not be attached to this profile yet.

author position
  • middle author4

Across the 4 of 4 papers where every author was matched, so the position is known.

fields
  • cond-mat.mes-hall1
  • cond-mat.mtrl-sci1
  • eess.SP1
  • physics.app-ph1
same name
  • Jianfeng Gao — 153 papers, h 98
  • Jianfeng Gao — 102 papers, h 60
  • Jianfeng Gao — 25 papers, h 10
  • Jianfeng Gao — 20 papers, h 13
  • Jianfeng Gao — 14 papers, h 17
  • Jianfeng Gao — 12 papers, h 12

Either other researchers who publish under this name, or the same person where the external sources have not merged their records.

identity via Semantic Scholar / OpenAlex

activity
20212026
collaborators

4 papers

cond-mat.mtrl-sci2026

Si/SiGe multi-channel superlattice structure epitaxial growth with segmented temperature control for Next-Generation Logic Devices

Wenlong Yao, Zhigang Li, Guobin Bai +5

Stacking multiple SiSiGe channels in advanced logic devices faces severe thermal budget accumulation, which degrades interfaces via Ge-Si interdiffusion and strain relaxation.This…

physics.app-ph2026

Physics Guided Exponential Model Design of High Ge Content SiGe Selective Epitaxy for Gate All Around Source/Drain Applications

Zhigang Li, Guobin Bai, Hengwei Cui +9

High germanium content silicon germanium (SiGe) epitaxy is critical for strain engineering in advanced gate all around (GAA) transistors. This paper demonstrates a physics guided e…

eess.SP2023

Exploring the Potential of Integrated Optical Sensing and Communication (IOSAC) Systems with Si Waveguides for Future Networks

Xiangpeng Ou, Ying Qiu, Ming Luo +17

Advanced silicon photonic technologies enable integrated optical sensing and communication (IOSAC) in real time for the emerging application requirements of simultaneous sensing an…

cond-mat.mes-hall2021

Field-Free Deterministic Writing of SOT-MTJ by Unipolar Current

Tengzhi Yang, Meiyin Yang, Lei Zhao +6

We propose a manufacturable solution for field-free writing of perpendicular SOT-MTJ without sacrificing integration density on a 200 mm wafer. The field-free writing operation can…

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