2 papers
cond-mat.mtrl-sci2026
Ultralow and Tunable Thermal Conductivity of Parylene C for Thermal Insulation in Advanced Packaging
Yicheng Wei, Han Xu, Xingqiang Zhang +2
Parylene C thin films have significant applications in advanced packaging of microelectronics. Their thermal properties are critical for thermal management of electronic devices. H…
cond-mat.mes-hall2026
Ion Implantation Enhanced Nucleation Facilitates Heat Transport across Atomically-Sharp Semiconductor Interfaces
Jinwen Liu, Zifeng Huang, Lina Yang +10
Overheating is a critical bottleneck limiting the performance and reliability of next-generation high-power and high-frequency electronics. Interfacial thermal resistance constitut…